在為耦(ou)合(he)/隔直(zhi)應用選擇電(dian)(dian)(dian)容(rong)(rong)器時，要考慮的關(guan)鍵參(can)數包括阻抗(kang)、等效(xiao)串聯電(dian)(dian)(dian)阻和(he)串聯諧振頻(pin)率。電(dian)(dian)(dian)容(rong)(rong)值主要取決于應用的頻(pin)率范圍和(he)負載(zai)/源阻抗(kang)。通常(chang)用于耦(ou)合(he)應用的電(dian)(dian)(dian)容(rong)(rong)器類型包括薄膜、陶瓷、鉭(tan)、鋁(lv)電(dian)(dian)(dian)解(jie)和(he)鋁(lv)有機/聚合(he)物電(dian)(dian)(dian)解(jie)電(dian)(dian)(dian)容(rong)(rong)器。

鉭電(dian)容(rong)器(qi)在高電(dian)容(rong)值下提供高穩定(ding)性，并且它們有(you)不同的變體。與陶瓷電(dian)容(rong)器(qi)相比，這些(xie)電(dian)容(rong)器(qi)具有(you)更(geng)高的 ESR 并且更(geng)昂貴(gui)。對于耦合(he)應用(yong)，鉭電(dian)容(rong)器(qi)比陶瓷電(dian)容(rong)器(qi)更(geng)受歡迎。

鋁電(dian)(dian)(dian)解(jie)電(dian)(dian)(dian)容器(qi)比(bi)鉭(tan)(tan)電(dian)(dian)(dian)容器(qi)便宜(yi)。它們提供穩(wen)定的(de)電(dian)(dian)(dian)容并具有(you)類似(si)于(yu)鉭(tan)(tan)電(dian)(dian)(dian)容器(qi)的(de) ESR 特性(xing)。但是(shi)，這些電(dian)(dian)(dian)容器(qi)的(de)尺寸(cun)相(xiang)對較大，不推薦用(yong)于(yu)電(dian)(dian)(dian)路(lu)板空間(jian)有(you)限的(de)電(dian)(dian)(dian)路(lu)。鋁電(dian)(dian)(dian)解(jie)電(dian)(dian)(dian)容器(qi)廣泛用(yong)于(yu)功(gong)率放大器(qi)中的(de)耦合應用(yong)。

陶瓷電(dian)容(rong)器(qi)(qi)價格低廉(lian)，采用(yong)小型 SMT 封裝(zhuang)。與鉭電(dian)容(rong)器(qi)(qi)相比，這(zhe)些電(dian)容(rong)器(qi)(qi)更便宜。盡管(guan)陶瓷電(dian)容(rong)器(qi)(qi)通常用(yong)于(yu)音(yin)頻和(he)射頻應用(yong)，但它們通常不(bu)適用(yong)于(yu)需要卓(zhuo)越性能的(de)應用(yong)。

薄膜電容器的(de)(de)大物理(li)尺(chi)寸限制(zhi)了它們在交流耦(ou)合中的(de)(de)應用。如果(guo)空(kong)間(jian)不是問題，聚丙烯和聚酯(zhi)電容器的(de)(de)特性使其(qi)成為前(qian)置放大器電路中耦(ou)合應用的(de)(de)良好選擇。